Invention Grant
US09385091B2 Reinforcement structure and method for controlling warpage of chip mounted on substrate
有权
用于控制安装在基板上的芯片翘曲的加固结构和方法
- Patent Title: Reinforcement structure and method for controlling warpage of chip mounted on substrate
- Patent Title (中): 用于控制安装在基板上的芯片翘曲的加固结构和方法
-
Application No.: US13791411Application Date: 2013-03-08
-
Publication No.: US09385091B2Publication Date: 2016-07-05
- Inventor: Chen-Hua Yu , Shang-Yun Hou , Cheng-Chieh Hsieh , Tsung-Shu Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/50 ; H01L23/29
Abstract:
A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die.
Public/Granted literature
- US20140252591A1 REINFORCEMENT STRUCTURE AND METHOD FOR CONTROLLING WARPAGE OF CHIP MOUNTED ON SUBSTRATE Public/Granted day:2014-09-11
Information query
IPC分类:
