Invention Grant
- Patent Title: Solid state thermal rectifier
- Patent Title (中): 固态热整流器
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Application No.: US12444149Application Date: 2007-10-02
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Publication No.: US09385065B2Publication Date: 2016-07-05
- Inventor: Chih-Wei Chang , Arunava Majumdar , Alexander K. Zettl
- Applicant: Chih-Wei Chang , Arunava Majumdar , Alexander K. Zettl
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Lawrence Berkeley National Laboratory
- International Application: PCT/US2007/080230 WO 20071002
- International Announcement: WO2008/042920 WO 20080410
- Main IPC: B32B9/00
- IPC: B32B9/00 ; H01L23/373 ; C01B31/02 ; F28F13/00 ; F28F21/02 ; B82Y10/00 ; B82Y30/00

Abstract:
Thermal rectifiers using linear nanostructures as core thermal conductors have been fabricated. A high mass density material is added preferentially to one end of the nanostructures to produce an axially non-uniform mass distribution. The resulting nanoscale system conducts heat asymmetrically with greatest heat flow in the direction of decreasing mass density. Thermal rectification has been demonstrated for linear nanostructures that are electrical insulators, such as boron nitride nanotubes, and for nanostructures that are conductive, such as carbon nanotubes.
Public/Granted literature
- US20100167004A1 SOLID STATE THERMAL RECTIFIER Public/Granted day:2010-07-01
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