Integrated circuit packages with enhanced thermal conduction are disclosed. A disclosed integrated circuit package includes a package substrate. An integrated circuit die with a layer of metal on its backside is mounted on the package substrate at a first temperature (e.g., reflow temperature). The package further includes a heat spreading lid that is bonded to the integrated circuit die at a second temperature, which is less than the first temperature. The heat spreading lid is formed over the integrated circuit die in which the heat spreading lid makes physical contact with the integrated circuit die via the layer of metal.