Invention Grant
- Patent Title: Stacked semiconductor chips with thermal management
- Patent Title (中): 堆叠的半导体芯片与热管理
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Application No.: US12860156Application Date: 2010-08-20
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Publication No.: US09385055B2Publication Date: 2016-07-05
- Inventor: Gamal Refai-Ahmed , Michael Z. Su , Bryan Black , Maxat Touzelbaev , Yizhang Yang
- Applicant: Gamal Refai-Ahmed , Michael Z. Su , Bryan Black , Maxat Touzelbaev , Yizhang Yang
- Applicant Address: CA Markham US CA Sunnyvale
- Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee Address: CA Markham US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/04 ; H01L23/367 ; H01L23/42 ; H01L25/065 ; H01L21/56 ; H01L23/10 ; H01L23/498
Abstract:
A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.
Public/Granted literature
- US20120043668A1 STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT Public/Granted day:2012-02-23
Information query
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