Invention Grant
- Patent Title: Flip-chip package covered with tape
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Application No.: US12962479Application Date: 2010-12-07
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Publication No.: US09385014B2Publication Date: 2016-07-05
- Inventor: Naomi Masuda
- Applicant: Naomi Masuda
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Priority: JP2007-023913 20070202
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/56 ; H01L23/00
Abstract:
A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.
Public/Granted literature
- US20110074029A1 FLIP-CHIP PACKAGE COVERED WITH TAPE Public/Granted day:2011-03-31
Information query
IPC分类:
