Invention Grant
- Patent Title: Card with built-in electronic component
- Patent Title (中): 内置电子元件卡
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Application No.: US13991843Application Date: 2011-12-05
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Publication No.: US09384436B2Publication Date: 2016-07-05
- Inventor: Jintaro Tatsu
- Applicant: Jintaro Tatsu
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Howard M. Gitten
- Priority: JP2010-271995 20101206
- International Application: PCT/JP2011/078058 WO 20111205
- International Announcement: WO2012/077632 WO 20120614
- Main IPC: H05K1/14
- IPC: H05K1/14 ; G06K19/077 ; G06K19/073 ; B42D25/00

Abstract:
Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
Public/Granted literature
- US20140016286A1 CARD WITH BUILT-IN ELECTRONIC COMPONENT Public/Granted day:2014-01-16
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