Invention Grant
US09383401B2 Device and system detecting breakage in dummy bumps and method thereof
有权
虚设凸起装置和系统检测断裂及其方法
- Patent Title: Device and system detecting breakage in dummy bumps and method thereof
- Patent Title (中): 虚设凸起装置和系统检测断裂及其方法
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Application No.: US13586163Application Date: 2012-08-15
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Publication No.: US09383401B2Publication Date: 2016-07-05
- Inventor: Takahiro Omori , Kenji Hirohata
- Applicant: Takahiro Omori , Kenji Hirohata
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/04 ; H01L25/065 ; G11C5/04 ; G11C29/02 ; G11C29/50 ; H05K1/02 ; G11C16/04

Abstract:
There is provided with an electronic device including: a main board, a plurality of electronic substrates, a first chain, a measuring unit and a controller, in which the plurality of electronic substrates each are mounted on the main board via solder joints, the first chain connects the solder joints in series throughout all of the electronic substrates, comprising a plurality of second chains each being a part of the first chain and connecting the solder joints in each corresponding one of the electronic substrates, the measuring unit measures an electrical resistance of the first chain and electrical resistances of the second chains, and the controller detects, if the electrical resistance of the first chain is equal to or higher than a first threshold value, the second chain having an electrical resistance equal to or higher than a corresponding second threshold value from among the second chains.
Public/Granted literature
- US20120306529A1 ELECTRONIC DEVICE AND ELECTRONIC SYSTEM Public/Granted day:2012-12-06
Information query