Invention Grant
- Patent Title: Component and method for producing a component
- Patent Title (中): 用于制造组件的组件和方法
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Application No.: US13818916Application Date: 2011-07-29
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Publication No.: US09382110B2Publication Date: 2016-07-05
- Inventor: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- Applicant: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE102010035390 20100825; DE102011018296 20110420
- International Application: PCT/EP2011/063127 WO 20110729
- International Announcement: WO2012/025334 WO 20120301
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81B7/00 ; B81C1/00
Abstract:
A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
Public/Granted literature
- US20130214405A1 Component and Method for Producing a Component Public/Granted day:2013-08-22
Information query
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