Invention Grant
- Patent Title: Method of manufacturing solid solution perforator patches and uses thereof
- Patent Title (中): 制造固溶透射片的方法及其用途
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Application No.: US12994148Application Date: 2009-05-21
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Publication No.: US09381680B2Publication Date: 2016-07-05
- Inventor: Sea-Jin Oh , Sung-Yun Kwon
- Applicant: Sea-Jin Oh , Sung-Yun Kwon
- Applicant Address: US CA Fremont
- Assignee: TheraJect, Inc.
- Current Assignee: TheraJect, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Brinks Gilson & Lione
- International Application: PCT/US2009/003145 WO 20090521
- International Announcement: WO2009/142741 WO 20091126
- Main IPC: B29C33/38
- IPC: B29C33/38 ; A61M37/00 ; B29C33/30 ; B29C33/00 ; A61B17/20 ; A61B17/00

Abstract:
Methods for fabricating and manufacturing solid solution perforators (SSPs) using sharp metal or glass needles and/or subsequent molding and use are described. The methods entail making microneedles by various precision machining techniques and micromold structures from curable materials. Various designs of patch, cartridge and applicator are described. Also described are methods for adjusting the microneedle mechanical strength using formulation and/or post-drying processes.
Public/Granted literature
- US20110121486A1 METHOD OF MANUFACTURING SOLID SOLUTION PEFORATOR PATCHES AND USES THEREOF Public/Granted day:2011-05-26
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