Invention Grant
- Patent Title: High frequency module and high frequency component
- Patent Title (中): 高频模块和高频分量
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Application No.: US14453848Application Date: 2014-08-07
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Publication No.: US09363344B2Publication Date: 2016-06-07
- Inventor: Takanori Uejima , Muneyoshi Yamamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-036907 20120223
- Main IPC: H04B1/18
- IPC: H04B1/18 ; H04M1/02 ; H04B1/00 ; H04B1/04 ; H04B1/48

Abstract:
A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.
Public/Granted literature
- US20140349720A1 HIGH FREQUENCY MODULE AND HIGH FREQUENCY COMPONENT Public/Granted day:2014-11-27
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