Invention Grant
- Patent Title: Modular interconnect structure
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Application No.: US13193238Application Date: 2011-07-28
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Publication No.: US09363203B2Publication Date: 2016-06-07
- Inventor: Martin S. Denham
- Applicant: Martin S. Denham
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04L12/50
- IPC: H04L12/50 ; H04L12/58 ; G06F15/173 ; G06F15/16 ; G06F13/00 ; H04L12/933 ; H04L12/935

Abstract:
Some embodiments of the invention include an interconnect structure to transfer data among a plurality of devices. The interconnect structure includes a crossbar and a number of interconnect branches coupled to the crossbar. Each of the interconnect branches includes a number of connector circuits coupled in series to transfer data in a group of devices of the plurality of devices. The crossbar includes a number of connector circuits coupled in series to allow one group of devices from one interconnect branch to exchange data with another group of devices from another interconnect branch. Other embodiments are described and claimed.
Public/Granted literature
- US20120020365A1 MODULAR INTERCONNECT STRUCTURE Public/Granted day:2012-01-26
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