A terminal crimping device includes crimp tooling including an anvil and a ram movable toward the anvil. A crimp zone is defined between the anvil and the ram that receives a wire and a terminal configured to be crimped to the wire by the crimp tooling. An ultrasonic transducer assembly is held by at least one of the anvil and the ram. The ultrasonic transducer assembly is ultrasonically coupled to the terminal and is ultrasonically isolated from the crimp tooling. The ultrasonic transducer assembly may directly engage the terminal. The terminal crimping device may include an isolation member ultrasonically isolating the ultrasonic transducer assembly from the crimp tooling.