Invention Grant
- Patent Title: Audio jack and electronic device including same
- Patent Title (中): 音频插孔和包括它的电子设备
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Application No.: US14571862Application Date: 2014-12-16
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Publication No.: US09362639B2Publication Date: 2016-06-07
- Inventor: Lin Zhang , Yuan Gao , Gaocai Han
- Applicant: Xiaomi Inc.
- Applicant Address: CN Beijing
- Assignee: Xiaomi Inc.
- Current Assignee: Xiaomi Inc.
- Current Assignee Address: CN Beijing
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: CN201410097702 20140317
- Main IPC: H01R13/73
- IPC: H01R13/73 ; H01R12/72 ; H01R12/71 ; H01R24/58 ; H01R12/70

Abstract:
An audio jack includes an insulated base including an upper plate and a lower plate connected to the upper plate, wherein a connecting portion between the upper plate and the lower plate forms a socket for plugging an audio plug, and a slot, formed between facing surfaces of the upper plate and the lower plate, is configured for installing a circuit board in a plugging manner; and a metal contact terminal configured to electrically connect the audio plug plugged into the socket to a corresponding conductive trace on the circuit board installed in the slot.
Public/Granted literature
- US20150263443A1 AUDIO JACK AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2015-09-17
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