Invention Grant
US09362603B2 Via structures and compact three-dimensional filters with the extended low noise out-of-band area
有权
通过结构和紧凑的三维滤波器，具有扩展的低噪声带外区域
- Patent Title: Via structures and compact three-dimensional filters with the extended low noise out-of-band area
- Patent Title (中): 通过结构和紧凑的三维滤波器，具有扩展的低噪声带外区域
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Application No.: US13806824Application Date: 2010-06-30
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Publication No.: US09362603B2Publication Date: 2016-06-07
- Inventor: Taras Kushta
- Applicant: Taras Kushta
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- International Application: PCT/JP2010/004313 WO 20100630
- International Announcement: WO2012/001742 WO 20120105
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H01P1/20 ; H05K1/02 ; H05K3/42 ; H05K3/46
Abstract:
A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.
Public/Granted literature
- US20130099876A1 VIA STRUCTURES AND COMPACT THREE-DIMENSIONAL FILTERS WITH THE EXTENDED LOW NOISE OUT-OF-BAND AREA Public/Granted day:2013-04-25
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