A resistive memory cell, e.g., CBRAM or ReRAM cell, may include a top electrode an a trench-shaped bottom electrode structure defining a bottom electrode connection and a sidewall extending from a first sidewall region adjacent the bottom electrode connection to a tip region defining a tip surface facing generally away from the bottom electrode connection, and wherein the tip surface facing away from the bottom electrode connection has a tip thickness that is less than a thickness of the first sidewall region adjacent the bottom electrode connection. An electrolyte switching region is arranged between the top electrode and the bottom electrode sidewall tip region to provide a path for the formation of a conductive filament or vacancy chain from the bottom electrode sidewall tip surface of the top electrode, via the electrolyte switching region, when a voltage bias is applied to the resistive memory cell.