Invention Grant
- Patent Title: Light emitting device, light emitting device package and lighting system including the same
- Patent Title (中): 发光装置,发光装置封装和包括其的照明系统
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Application No.: US12729472Application Date: 2010-03-23
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Publication No.: US09362457B2Publication Date: 2016-06-07
- Inventor: Hyun-Don Song
- Applicant: Hyun-Don Song
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2009-0024835 20090324
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/14 ; H01L33/04

Abstract:
A light emitting device (LED), an LED package, and a lighting system including the LED package are provided. The light emitting device (LED) may include a light emitting structure, a carrier injection layer, and an electrode layer. The light emitting structure may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. The carrier injection layer may be positioned over the light emitting structure, and the electrode layer may be positioned over the carrier injection layer.
Public/Granted literature
- US20100244084A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME Public/Granted day:2010-09-30
Information query
IPC分类: