Invention Grant
- Patent Title: Lateral MOSFET
- Patent Title (中): 横向MOSFET
-
Application No.: US13666632Application Date: 2012-11-01
-
Publication No.: US09362272B2Publication Date: 2016-06-07
- Inventor: Huei-Ru Liu , Chien-Chih Chou , Kong-Beng Thei
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L29/06 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L27/088 ; H01L29/423

Abstract:
A lateral MOSFET comprises a plurality of isolation regions formed in a substrate, wherein a first isolation region is of a top surface lower than a top surface of the substrate. The lateral MOSFET further includes a gate electrode layer having a first gate electrode layer formed over the first isolation region and a second gate electrode layer formed over the top surface of the substrate, wherein a top surface of the first gate electrode layer is lower than a top surface of the second gate electrode layer.
Public/Granted literature
- US20140117444A1 Lateral MOSFET Public/Granted day:2014-05-01
Information query
IPC分类: