An optoelectronic component includes a carrier, a first optoelectronic semiconductor chip arranged on the carrier, a first conversion element arranged on the first semiconductor chip, a second optoelectronic semiconductor chip arranged on the carrier and a second conversion element arranged on the second semiconductor chip. The optoelectronic component also includes an insulation material arranged on the carrier. The insulation material surrounds the first and second semiconductor chips and the first and second conversion element. The first conversion element is embodied in a stepped fashion and has a first and a second section wherein the first section projects laterally beyond the second section.