Invention Grant
US09362250B2 Die bonder and bonding method 有权
焊接机和接合方法

Die bonder and bonding method
Abstract:
The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques.In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.
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