Invention Grant
- Patent Title: Die bonder and bonding method
- Patent Title (中): 焊接机和接合方法
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Application No.: US13784253Application Date: 2013-03-04
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Publication No.: US09362250B2Publication Date: 2016-06-07
- Inventor: Ryuichi Takano , Naoki Okamoto
- Applicant: Fasford Technology Co., Ltd.
- Applicant Address: JP Minami-Alps
- Assignee: Fasford Technology Co., Ltd.
- Current Assignee: Fasford Technology Co., Ltd.
- Current Assignee Address: JP Minami-Alps
- Agency: Crowell & Moring LLP
- Priority: JP2012-201728 20120913
- Main IPC: B29C65/00
- IPC: B29C65/00 ; H01L23/00

Abstract:
The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques.In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.
Public/Granted literature
- US20140069564A1 Die Bonder And Bonding Method Public/Granted day:2014-03-13
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