Invention Grant
- Patent Title: Semiconductor module and semiconductor device
- Patent Title (中): 半导体模块和半导体器件
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Application No.: US14787103Application Date: 2013-05-09
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Publication No.: US09362219B2Publication Date: 2016-06-07
- Inventor: Tatsuya Kawase , Mikio Ishihara , Noboru Miyamoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2013/063053 WO 20130509
- International Announcement: WO2014/181426 WO 20141113
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/498 ; H01L23/473 ; H01L23/31 ; H01L25/07 ; H01L23/373 ; H01L21/48 ; H01L23/053 ; H01L23/367 ; H01L23/00 ; H01L23/40
Abstract:
A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.
Public/Granted literature
- US20160079155A1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE Public/Granted day:2016-03-17
Information query
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