Invention Grant
- Patent Title: Conductive pads and methods of formation thereof
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Application No.: US14737298Application Date: 2015-06-11
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Publication No.: US09362216B2Publication Date: 2016-06-07
- Inventor: Johann Gatterbauer , Bernhard Weidgans
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/14 ; H01L23/498 ; H01L23/532
Abstract:
In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive pad. The device further includes a solder barrier disposed over the etch stop layer.
Public/Granted literature
- US20150287668A1 Conductive Pads and Methods of Formation Thereof Public/Granted day:2015-10-08
Information query
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