Invention Grant
- Patent Title: Electronic device and method for manufacturing same
- Patent Title (中): 电子装置及其制造方法
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Application No.: US14279979Application Date: 2014-05-16
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Publication No.: US09362202B2Publication Date: 2016-06-07
- Inventor: Shunji Baba , Kenji Fukuzono , Yuki Hoshino
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2013-137437 20130628
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20 ; H05K5/00 ; H05K7/00 ; H01L23/473 ; H01L21/48 ; H05K1/02

Abstract:
An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.
Public/Granted literature
- US20150003012A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-01-01
Information query