Invention Grant
US09362194B2 Semiconductor chip covered with sealing resin having a filler material
有权
用具有填充材料的密封树脂覆盖的半导体芯片
- Patent Title: Semiconductor chip covered with sealing resin having a filler material
- Patent Title (中): 用具有填充材料的密封树脂覆盖的半导体芯片
-
Application No.: US14711138Application Date: 2015-05-13
-
Publication No.: US09362194B2Publication Date: 2016-06-07
- Inventor: Atsushi Tomohiro
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: JP2014100176 20140514
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L21/56 ; H01L23/495
Abstract:
A semiconductor device includes a wiring substrate, a sealing resin layer formed on the wiring substrate out of a filler-containing resin and having a one-sided filler content ratio, and at least one semiconductor chip mounted on the wiring substrate such that the semiconductor chip is located offset to be closer to an area where the filler content ratio is relatively low in the sealing resin layer and is sealed in its offset location in the sealing resin layer.
Public/Granted literature
- US20150332986A1 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIP COVERED WITH SEALING RESIN Public/Granted day:2015-11-19
Information query
IPC分类:
