Forming strained fins of different material on a substrate

Invention Grant

US09362182B2 Forming strained fins of different material on a substrate 有权

Title translation: 在基材上形成不同材料的应变片

Patent Title: Forming strained fins of different material on a substrate
Patent Title (中): 在基材上形成不同材料的应变片
Application No.: US14534678

Application Date: 2014-11-06
Publication No.: US09362182B2

Publication Date: 2016-06-07
Inventor: Kangguo Cheng , Bruce B. Doris , Pouya Hashemi , Ali Khakifirooz , Alexander Reznicek
Applicant: International Business Machines Corporation
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agent Erik K. Johnson; Louis J. Percello
Main IPC: H01L21/336
IPC: H01L21/336 ; H01L21/84 ; H01L21/8234 ; H01L27/12 ; H01L27/092

Abstract:

A method, and the resulting structure, of forming two fins with different types of strain and material on the same substrate.

Abstract(Chinese):

在同一基板上形成具有不同类型的应变和材料的两个翅片的方法和所得到的结构。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/334	....制造单极型器件的台阶式工艺
H01L21/335	.....场效应晶体管
H01L21/336	......带有绝缘栅的