Invention Grant
- Patent Title: Dicing tape-integrated film for semiconductor back surface
-
Application No.: US14188991Application Date: 2014-02-25
-
Publication No.: US09362156B2Publication Date: 2016-06-07
- Inventor: Naohide Takamoto , Takeshi Matsumura , Goji Shiga
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-292770 20091224; JP2010-253091 20101111
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/683 ; H01L21/67 ; H01L23/00
Abstract:
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.
Public/Granted literature
- US20140175677A1 DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE Public/Granted day:2014-06-26
Information query
IPC分类:
