Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US14688347Application Date: 2015-04-16
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Publication No.: US09362150B2Publication Date: 2016-06-07
- Inventor: Masatoshi Kaneda , Kazuki Nagamoto , Ryo Shimada
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-086246 20140418
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/683

Abstract:
A substrate processing apparatus includes a housing, a mounting table provided in the housing and configured to mount a substrate thereon, a drive mechanism provided below the mounting table so as to move the mounting table in a front-back direction between a delivering/receiving location for the substrate and a processing chamber, an ultraviolet irradiation unit configured to irradiate the substrate in the processing chamber with ultraviolet rays, a partition member provided to partition the processing chamber and a drive chamber with the drive mechanism positioned therein up and down, the partition member having a slit for allowing movement of a support supporting the mounting table, first exhaust ports formed in the drive chamber to exhaust an atmosphere in the drive chamber, and second exhaust ports formed along a lengthwise direction of the slit so as to face the slit.
Public/Granted literature
- US20150303077A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2015-10-22
Information query
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