Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US14466966Application Date: 2014-08-23
-
Publication No.: US09362110B2Publication Date: 2016-06-07
- Inventor: Nobuyuki Ikarashi , Takashi Onizawa , Motofumi Saitoh
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2012-000164 20120104
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/02 ; H01L29/778 ; H01L21/28 ; H01L29/51 ; H01L29/66 ; H01L29/78 ; H01L29/20 ; H01L21/324 ; H01L29/40

Abstract:
A first nitride semiconductor layer contains Ga. The first nitride semiconductor layer is, for example, a GaN layer, an AlGaN layer, or an AlInGaN layer. Then, an aluminum oxide layer has tetra-coordinated Al atoms each surrounded by four ◯ atoms and hexa-coordinated Al atoms each surrounded by six ◯ atoms as Al atoms in the interface region with respect to the first nitride semiconductor layer. The interface region is a region apart, for example, by 1.5 nm or less from the interface with respect to the first nitride semiconductor layer. Then, in the interface region, the tetra-coordinated Al atoms are present by 30 at % or more and less than 50 at % based on the total number of Al atoms.
Public/Granted literature
- US20140363982A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2014-12-11
Information query
IPC分类: