Invention Grant
US09362090B2 Plasma processing apparatus, plasma processing method, and storage medium
有权
等离子体处理装置，等离子体处理方法和存储介质
- Patent Title: Plasma processing apparatus, plasma processing method, and storage medium
- Patent Title (中): 等离子体处理装置，等离子体处理方法和存储介质
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Application No.: US12973563Application Date: 2010-12-20
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Publication No.: US09362090B2Publication Date: 2016-06-07
- Inventor: Masanobu Honda , Yutaka Matsui , Manabu Sato
- Applicant: Masanobu Honda , Yutaka Matsui , Manabu Sato
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-079638 20060322; JP2006-168684 20060619
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H01J7/24 ; H05B31/26 ; H01J37/32 ; H01L21/311 ; H01L21/02 ; H01L21/67
Abstract:
A plasma processing apparatus that enables polymer to be removed from an electrically insulated electrode. A susceptor of the plasma processing apparatus is disposed in a substrate processing chamber having a processing space therein. A radio frequency power source is connected to the susceptor. An upper electrode plate is electrically insulated from a wall of the substrate processing chamber and from the susceptor. A DC power source is connected to the upper electrode plate. A controller of the plasma processing apparatus determines a value of a negative DC voltage to be applied to the upper electrode plate in accordance with processing conditions for RIE processing to be carried out.
Public/Granted literature
- US20110088850A1 PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2011-04-21
Information query
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