A granulating device for granulating thermoplastic materials. The device has a die head, a cutting chamber housing, and at least one insulating element comprising thermally insulating material. The insulating element is situated between a die head element and a cutting chamber housing element. At least one tempering device situated between the insulating element and cutting chamber housing element or adjacent to the insulating element is provided. The tempering device acts to remove unwanted heat introduced in its vicinity, or to replenish heat undesirably removed from its vicinity.