Invention Grant
- Patent Title: High throughput fabrication of nanoparticles
- Patent Title (中): 纳米粒子的高通量制造
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Application No.: US14499599Application Date: 2014-09-29
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Publication No.: US09358215B2Publication Date: 2016-06-07
- Inventor: David M. Dewitt
- Applicant: BIND BIOSCIENCES, INC.
- Applicant Address: US MA Cambridge
- Assignee: BIND THERAPEUTICS, INC.
- Current Assignee: BIND THERAPEUTICS, INC.
- Current Assignee Address: US MA Cambridge
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Main IPC: A61K9/51
- IPC: A61K9/51 ; A61K47/48 ; B82Y5/00 ; A61J3/00 ; A61K31/337
Abstract:
This application provides a high throughput method of making nanoparticles that utilizes plates comprising wells (e.g., 96-well plates).
Public/Granted literature
- US20150018412A1 HIGH THROUGHPUT FABRICATION OF NANOPARTICLES Public/Granted day:2015-01-15
Information query
