Invention Grant
- Patent Title: Heat dissipating substrate, and element equipped with same
- Patent Title (中): 散热基板，以及配备有散热基板的元件
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Application No.: US14032302Application Date: 2013-09-20
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Publication No.: US09332631B2Publication Date: 2016-05-03
- Inventor: Shunji Fukuda , Katsuya Sakayori , Toshimasa Takarabe
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2011-064537 20110323; JP2011-222364 20111006; JP2012-066158 20120322
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L51/52 ; C08G73/10 ; H01L23/373
Abstract:
A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm.
Public/Granted literature
- US20140085830A1 HEAT DISSIPATING SUBSTRATE, AND ELEMENT EQUIPPED WITH SAME Public/Granted day:2014-03-27
Information query
