Embodiments of an integrated resistor may be incorporated into monolithic transistor circuits and packaged RF amplifier devices. An embodiment of an integrated resistor includes a semiconductor substrate and a resistor formed over the top surface of the semiconductor substrate from resistive material. The resistor includes at least first and second resistive sections. The first resistive section is tapered so that the first resistive section widens toward an input end of the resistor. The second resistive section is coupled in series with the first resistive section. According to a further embodiment, the second resistive section also is tapered so that the second resistive section widens toward an output end of the resistor. According to another further embodiment, a third resistive section with one or more meanders is coupled in series between the first and second resistive sections.