Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US14709047Application Date: 2015-05-11
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Publication No.: US09331077B2Publication Date: 2016-05-03
- Inventor: Koichi Matsumoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-243251 20101029
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/092 ; H01L21/8238 ; H01L29/49 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device includes: a first conductivity type transistor and a second conductivity type transistor, wherein each of the first conductivity type transistor and the second conductivity type includes a gate insulating film formed on a base, a metal gate electrode formed on the gate insulating film, and side wall spacers formed at side walls of the metal gate electrode, wherein the gate insulating film is made of a high dielectric constant material, and wherein offset spacers are formed between the side walls of the metal gate electrode and the inner walls of the side wall spacers in any one of the first conductivity type transistor and the second conductivity type transistor, or offset spacers having different thicknesses are formed in the first conductivity type transistor and the second conductivity type transistor.
Public/Granted literature
- US20150243661A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2015-08-27
Information query
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