Invention Grant
- Patent Title: Integrated circuit package with voltage distributor
- Patent Title (中): 具有电压分配器的集成电路封装
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Application No.: US14315766Application Date: 2014-06-26
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Publication No.: US09331046B2Publication Date: 2016-05-03
- Inventor: Chu-Chung Lee , Kian Leong Chin , Kevin J. Hess , James Patrick Johnston , Tu-Anh N. Tran , Heng Keong Yip
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/56
Abstract:
An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
Public/Granted literature
- US20140308779A1 INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR Public/Granted day:2014-10-16
Information query
IPC分类:
