Invention Grant
US09330996B2 Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
有权
半导体模块系统，半导体模块布置和将半导体模块安装在散热器上的方法
- Patent Title: Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
- Patent Title (中): 半导体模块系统，半导体模块布置和将半导体模块安装在散热器上的方法
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Application No.: US14253301Application Date: 2014-04-15
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Publication No.: US09330996B2Publication Date: 2016-05-03
- Inventor: Michael Daginnus
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102013207043 20130418
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/02 ; H01L23/00 ; H01L23/36 ; H01L23/04 ; H01L21/50 ; H01L23/427
Abstract:
A semiconductor module system has a semiconductor module and a protective cover. The semiconductor module has a bottom side with a heat dissipation surface and a top side opposite the bottom side, the top side being separated from the bottom side in a vertical direction. The protective cover can be mounted irreleasably on the semiconductor module in such a way that, in a mounted state, the top side is exposed and the protective cover covers the heat dissipation surface. By virtue of the protective cover, a thermal interface material applied onto the heat dissipation surface can be protected.
Public/Granted literature
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