Invention Grant
- Patent Title: Bipolar mobile electrostatic carriers for wafer processing
- Patent Title (中): 用于晶圆处理的双极移动静电载体
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Application No.: US13520139Application Date: 2010-12-30
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Publication No.: US09330952B2Publication Date: 2016-05-03
- Inventor: Mehrdad M. Moslehi , David Xuan-Qi Wang
- Applicant: Mehrdad M. Moslehi , David Xuan-Qi Wang
- Applicant Address: US CA Milpitas
- Assignee: Solexel, Inc.
- Current Assignee: Solexel, Inc.
- Current Assignee Address: US CA Milpitas
- Agent John Wood
- International Application: PCT/US2010/062614 WO 20101230
- International Announcement: WO2011/082371 WO 20110707
- Main IPC: H01L21/683
- IPC: H01L21/683 ; G03F7/20 ; H01L21/762 ; H01L21/768

Abstract:
In one embodiment, there is provided a carrier comprising a top semiconductor layer having isolated positive electrode regions and isolated negative electrode regions separated by a frontside trench through the top semiconductor layer extending at least to an underlying insulating layer positioned between the top semiconductor layer and a bottom semiconductor layer. A dielectric layer covers the top exposed surfaces of the carrier. Backside trenches through the bottom semiconductor layer extending at least to the insulating layer form isolated backside regions corresponding to the frontside positive and negative electrode regions. Backside contacts positioned on the bottom semiconductor layer and coupled to the positive and negative electrode regions allow for the electric charging of the frontside electrode regions.
Public/Granted literature
- US20130141833A1 MOBILE ELECTROSTATIC CARRIERS FOR THIN WAFER PROCESSING Public/Granted day:2013-06-06
Information query
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