Invention Grant
- Patent Title: Apparatus and method for dissipating heat
- Patent Title (中): 耗散热量的装置和方法
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Application No.: US13873862Application Date: 2013-04-30
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Publication No.: US09307682B2Publication Date: 2016-04-05
- Inventor: Tadaomi Fujieda , Tatsuhito Aono
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.
Public/Granted literature
- US20140321058A1 APPARATUS AND METHOD FOR DISSIPATING HEAT Public/Granted day:2014-10-30
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