A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a first metal trace having a first metal trace width between about 30 nm to about 60 nm and a first metal trace length. A second metal trace has a second metal trace width between about 10 nm to about 20 nm and a second metal trace length, the first metal trace length different than the second metal trace length. A dielectric layer is between the first metal trace and the second metal trace. The dielectric layer has a dielectric layer width between the first metal trace and the second metal trace between about 10 nm to about 20 nm. The semiconductor arrangement is formed in a manner that allows metal traces having small dimensions to be formed where the metal traces have different dimensions from one another.