Invention Grant
- Patent Title: Automated material handling system and method for semiconductor manufacturing
- Patent Title (中): 自动化材料处理系统和半导体制造方法
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Application No.: US13409540Application Date: 2012-03-01
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Publication No.: US09305815B2Publication Date: 2016-04-05
- Inventor: Chi-Feng Tung , Mao-Lin Kao , Hsiang-Yin Shen , Chin-Hsiang Lin
- Applicant: Chi-Feng Tung , Mao-Lin Kao , Hsiang-Yin Shen , Chin-Hsiang Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.
Public/Granted literature
- US20130230375A1 AUTOMATED MATERIAL HANDLING SYSTEM AND METHOD FOR SEMICONDUCTOR MANUFACTURING Public/Granted day:2013-09-05
Information query
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