Invention Grant
- Patent Title: Integrated circuit packaging system with coreless substrate and method of manufacture thereof
- Patent Title (中): 具有无芯基板的集成电路封装系统及其制造方法
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Application No.: US14316461Application Date: 2014-06-26
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Publication No.: US09305809B1Publication Date: 2016-04-05
- Inventor: Emmanuel Espiritu , Allan Pumatong Ilagan , Jeffrey David Punzalan
- Applicant: Emmanuel Espiritu , Allan Pumatong Ilagan , Jeffrey David Punzalan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/44 ; H01L21/48 ; H01L23/12 ; H01L23/00 ; H01L21/56 ; H01L23/538 ; H01L23/28
Abstract:
An integrated circuit packaging system and method of manufacture thereof includes: discrete components coupled to a top trace; vias attached to the top trace separated from the discrete components; a dielectric layer on the top trace, the discrete components, and the vias, includes a component surface formed above the discrete components, with the top trace coplanar with the dielectric layer; and system interconnects coupled to the vias for electrically connecting the top trace, the discrete components, or a combination thereof to the system interconnects.
Public/Granted literature
- US3132390A Slide clamp Public/Granted day:1964-05-12
Information query
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