Invention Grant
- Patent Title: Tantalum capacitor and method of manufacturing the same
- Patent Title (中): 钽电容器及其制造方法
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Application No.: US14097872Application Date: 2013-12-05
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Publication No.: US09305712B2Publication Date: 2016-04-05
- Inventor: Hong Kyu Shin , Jae Bum Cho , Wan Suk Yang , Hyun Sub Oh
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0092448 20130805
- Main IPC: H01G9/15
- IPC: H01G9/15 ; H01G9/012 ; H01G9/10

Abstract:
There is provided a tantalum capacitor, including: a capacitor body including a tantalum powder and having a tantalum wire, a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body, an anode lead frame including an anode mounting part and an anode terminal part, the anode terminal part being connected to the tantalum wire, a thin plate electrode formed on a lower surface of the capacitor body and exposed through the other end surface of the molding part, and a cathode lead frame including a cathode mounting part and a cathode terminal part, the cathode terminal part being connected to the thin plate electrode.
Public/Granted literature
- US20150036265A1 TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-02-05
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