Invention Grant
- Patent Title: High performance audio headphones and speaker devices
- Patent Title (中): 高性能音频耳机和扬声器设备
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Application No.: US14452240Application Date: 2014-08-05
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Publication No.: US09282394B1Publication Date: 2016-03-08
- Inventor: Dan W. Clark
- Applicant: Dan W. Clark
- Applicant Address: US CA San Diego
- Assignee: Mr Speakers, LLC
- Current Assignee: Mr Speakers, LLC
- Current Assignee Address: US CA San Diego
- Agent Steven C. Tietsworth, Esq.
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10
Abstract:
A headphone may include a driver assembly and a headphone cup having an adjustable airflow valve assembly and/or an adjustable headphone interior cup volume adjustment assembly. Headphone cups and/or other elements may be printed with a 3D printer, and may be tailored to a particular headphone driver element.
Information query
