Invention Grant
- Patent Title: Speaker enclosure
- Patent Title (中): 扬声器外壳
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Application No.: US14384361Application Date: 2012-05-31
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Publication No.: US09282386B2Publication Date: 2016-03-08
- Inventor: Kok Chean Low
- Applicant: Kok Chean Low
- Applicant Address: SG Singapore
- Assignee: ELECTRO ACOUSTICS RESEARCH (1999) PTE LTD
- Current Assignee: ELECTRO ACOUSTICS RESEARCH (1999) PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Greer Burns & Crain Ltd.
- Agent Gregory P. Einhorn
- Priority: SG201201757-0 20120312
- International Application: PCT/SG2012/000194 WO 20120531
- International Announcement: WO2013/137821 WO 20130919
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R31/00 ; B23P11/00 ; H04R1/28

Abstract:
A loud speaker enclosure and a method of forming the loudspeaker enclosure comprising the following steps: combining a first layer of a sheet material, a middle layer of a cored configuration and a second layer of the sheet material by using adhesive to form a panel; laminating a sheet of resilient material on the panel; forming a plurality of grooves extending partially through the depth of the panel, each of the grooves extending transverse to the panel such that the panel can be folded at the groove to form an enclosed main body; bending the panel at the location of the grooves to form the enclosed main body; capping the enclosed main body with a top wall and a bottom wall with separate panels wherein the main body, the top wall and the bottom wall defines the interior volume of the enclosure.
Public/Granted literature
- US20150027804A1 SPEAKER ENCLOSURE Public/Granted day:2015-01-29
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