A busway and a method of assembling the same in which a flowable, uncured epoxy is applied between insulated busbar conductors that are stacked on top of one another and inner surfaces of the busway housing into which the stacked conductors are placed to form an enclosed busway. The busbar conductors are insulated by an epoxy powder coat, which can develop pinholes during the curing of the epoxy powder. A flowable, curable dielectric material, such as epoxy, is applied between the outermost busbar conductors and the inner surfaces of the top and bottom pieces of the busway housing. Optionally, epoxy is also applied between adjacent pairs of busbar conductors, which are stacked and arranged into the housing. Pressure is applied to the housing stack, and the epoxy is allowed to cure, resulting in a busway having superior thermal performance, dielectric integrity, and mechanical strength compared to conventional busways.