Invention Grant
- Patent Title: Apparatus for manufacturing a hierarchical structure
- Patent Title (中): 用于制造分层结构的装置
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Application No.: US13122240Application Date: 2009-09-28
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Publication No.: US09281230B2Publication Date: 2016-03-08
- Inventor: Jae-Hyun Kim , Hak-Joo Lee , Seung-Min Hyun , Seung-Woo Han , Byung-Ik Choi
- Applicant: Jae-Hyun Kim , Hak-Joo Lee , Seung-Min Hyun , Seung-Woo Han , Byung-Ik Choi
- Applicant Address: KR Daejeon
- Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
- Current Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
- Current Assignee Address: KR Daejeon
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- Priority: KR10-2008-0096815 20081001
- International Application: PCT/KR2009/005527 WO 20090928
- International Announcement: WO2010/038963 WO 20100408
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B29C43/46 ; B29C43/48 ; B29C47/06 ; B32B27/00 ; H01L23/02 ; B29L9/00 ; H01L23/00 ; H01L25/065
Abstract:
The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.
Public/Granted literature
- US20120118506A1 APPARATUS FOR MANUFACTURING A HIERARCHICAL STRUCTURE Public/Granted day:2012-05-17
Information query
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