An apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a molded positioning body. The molded positioning body has a planar first main face and a plurality of receptacles for receiving the power semiconductor modules therein. Each receptacle has a stop means, by which a main face of each power semiconductor module is positioned plane-parallel with one another and in alignment with the first main face of the molded positioning body. The receptacle is embodied as tapering inwardly in the direction of the first main face, beginning at the second main face.