Invention Grant
- Patent Title: Combined wiring board and method for manufacturing the same
- Patent Title (中): 组合线路板及其制造方法
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Application No.: US14542753Application Date: 2014-11-17
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Publication No.: US09277650B2Publication Date: 2016-03-01
- Inventor: Teruyuki Ishihara , Michimasa Takahashi
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-236517 20131115
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02 ; H05K3/36 ; H05K3/00
Abstract:
A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
Public/Granted literature
- US20150136454A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-05-21
Information query
