Invention Grant
- Patent Title: Capacitive MEMS element including a pressure-sensitive diaphragm
- Patent Title (中): 电容式MEMS元件包括一个压敏膜片
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Application No.: US14470619Application Date: 2014-08-27
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Publication No.: US09277329B2Publication Date: 2016-03-01
- Inventor: Christoph Schelling , Rolf Scheben , Ricardo Ehrenpfordt
- Applicant: Christoph Schelling , Rolf Scheben , Ricardo Ehrenpfordt
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102013217312 20130830
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R23/00 ; H04R7/00 ; H04R19/00 ; H04R31/00 ; H04R19/01

Abstract:
An implementation for an electret in a capacitive MEMS element including a pressure-sensitive diaphragm, which is produce-able using standard methods of semiconductor technology for easy integration into the manufacturing process of MEMS semiconductor elements. Such MEMS elements include at least one pressure-sensitive diaphragm including at least one deflectable diaphragm electrode of a capacitor system for signal detection and one fixed non-pressure-sensitive counter-element including at least one counter-electrode of this capacitor system, at least one electrode of the capacitor system being provided with an electrically charged electret, so that there is a potential difference between the two electrodes of the capacitor system. The electret includes at least two adjacent layers made from different dielectric materials, electrical charges being stored on their boundary surface.
Public/Granted literature
- US20150063608A1 Capacitive mems element including a pressure-sensitive diaphragm Public/Granted day:2015-03-05
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