Invention Grant
- Patent Title: Electrical connector with grounding mechanism contacting outer shell
- Patent Title (中): 带接地机构的电气连接器与外壳接触
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Application No.: US14552712Application Date: 2014-11-25
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Publication No.: US09276365B2Publication Date: 2016-03-01
- Inventor: Wang-I Yu , Mao-Jung Huang , Li-Li Liang , Yong-Gang Zhang , Kun Liu
- Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Applicant Address: CN Taicang, Jiangsu Province
- Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee Address: CN Taicang, Jiangsu Province
- Agency: Sughrue Mion, PLLC
- Priority: CN201420308487U 20140611; CN201410445078 20140903
- Main IPC: H01R9/03
- IPC: H01R9/03 ; H01R24/70 ; H01R13/6587 ; H01R13/6594

Abstract:
An electrical connector includes an upper contact module, a lower contact module, an outer insulative housing inject-molded with the upper contact module and the lower contact module, a shielding mechanism at least partly fixed in the outer insulative housing and a metallic outer shell enclosing the outer insulative housing. The upper contact module includes a number of upper contacts and an upper housing inject-molded with the upper contacts. The lower contact module includes a number of lower contacts and a lower housing inject-molded with the lower contacts. The shielding mechanism and the metallic outer shell are in mechanical contact with each other for achieving a relative larger grounding area.
Public/Granted literature
- US20150364883A1 ELECTRICAL CONNECTOR WITH GROUNDING MECHANISM CONTACTING OUTER SHELL Public/Granted day:2015-12-17
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