Invention Grant
- Patent Title: Receptacle for connecting modular electronic instruments
- Patent Title (中): 连接模块化电子仪器的插座
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Application No.: US14618811Application Date: 2015-02-10
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Publication No.: US09276349B2Publication Date: 2016-03-01
- Inventor: Kenichi Yoshida , Hiroshi Akaishi
- Applicant: YOKOGAWA ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-109270 20140527
- Main IPC: H01R4/50
- IPC: H01R4/50 ; H01R13/518 ; H01R13/639 ; H01R13/66

Abstract:
A receptacle is provided to connect modular electronic instruments to each other. A box-shaped case has a front face having an opening for inserting a single modular electronic instrument into the box-shaped case. A first connector is disposed inside the box-shaped case to connect the single modular electronic instrument to the receptacle. A second connector is disposed on a first side face of the receptacle for connecting the receptacle to a first receptacle on the side of the first side face. A third connector is disposed on a second side face of the receptacle for connecting the receptacle to a second receptacle on the side of the second side face. A lock secures the connection with one of the first and second receptacles. A leg is disposed on the bottom face. The position of the leg is deviated only to one of the first or second side faces.
Public/Granted literature
- US20150349452A1 RECEPTACLE FOR CONNECTING MODULAR ELECTRONIC INSTRUMENTS Public/Granted day:2015-12-03
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